Stress is the enemy of stable, reliable sensor performance. Packaged devices on printed circuit boards (PCBs) are subject to significant mechanical stress due to coefficient of thermal expansion (CTE) mismatches between the PCB, the package, and the device itself. PCB materials and solder joints also creep over time, causing drift in sensor offsets and sensitivities. System housings or enclosures induce stress on components as materials expand and contract with fluctuations in outside temperature.
Epack’s ERP isolates your transducer from these sources of stress, reducing sensor drift and enabling smaller & lower cost system enclosures.